This family of printed circuit boards, one of the most advanced from a technological point of view, is used when it is necessary to solve problems of miniaturization, substantially allowing the use of the z-axis to interconnect, by means of plated through holes, the different circuit planes (layers), present in a variable number, from 4 up.
APPLICATIONS:
They are mainly used in the field of mobile phones and computers, but also in the on-board electronics of the automotive sector, which are becoming more and more complex.
MATERIALS:
The base laminate for the multilayer printed circuit boards is generally the FR-4, in its various shades of Tg, but for particular applications materials with polymide (or different) base can also be used.
PROCESS:
The manufacturing process, similar the PTH printed circuit boards one, needs initially to prepare the inner part through a technique which consists in a hot-pressing of the inner layers, the partially polymerized (pre-preg) epoxyglass layers and of the copper sheet.