Heat sink paste

Due to a big variety of application, thermal interfaces can be used in PCB’s to reach different scopes.
Silga’s know-how in screen printing, allow to include this feature inside it’s production lines.
Screen printing, is the only way for a selective printing, only on specific areas of the PCB, avoiding material scrap.
Thermal interfaces, are electrical insulating paste, used for heat dissipation.

Screen printed paste, used for heat pull out from via holes.
Is mainly used on FR4- or multilayer PCB’s and applied on components opposite side, when the board is located in the middle of the chassis, away from heat sink.
This technology let possible, heat removal from inner layer, through conduction process.
One of its most important characteristhics is the strenght, up to 120 um thicknesses.