{"id":2068,"date":"2020-11-20T16:08:33","date_gmt":"2020-11-20T15:08:33","guid":{"rendered":"https:\/\/silgaelectronics.com\/surface-finishing\/"},"modified":"2024-10-18T17:02:20","modified_gmt":"2024-10-18T15:02:20","slug":"surface-finishings","status":"publish","type":"page","link":"https:\/\/silgaelectronics.com\/en\/finishings\/surface-finishings\/","title":{"rendered":"Surface finishings"},"content":{"rendered":"<p>[vc_row][vc_column][vc_single_image image=&#8221;2251&#8243; img_size=&#8221;full&#8221;][vc_column_text]Silga is a leader company in galvanic treatments, and surface finishings. Its PCBs division can get all the know-how from that, never reached from anyone else in the same sector.<\/p>\n<p>Thank&#8217;s to the big variety of surface finishings, Silga become a primacy for:<\/p>\n<ul>\n<li>Range of products<\/li>\n<li>Innovation<\/li>\n<li>Realiability<\/li>\n<\/ul>\n<p>[\/vc_column_text][\/vc_column][\/vc_row][vc_row css=&#8221;.vc_custom_1605291204225{margin-top: 50px !important;}&#8221;][vc_column][vc_tta_tour style=&#8221;flat&#8221; shape=&#8221;square&#8221; color=&#8221;white&#8221; gap=&#8221;20&#8243; active_section=&#8221;1&#8243; no_fill_content_area=&#8221;true&#8221;][vc_tta_section title=&#8221;Passivated Copper&#8221; tab_id=&#8221;passivated-copper&#8221;]<div class=\"section-title-wrapper text-left shortcode-rand-1 factrie-inline-css\" data-css=\"&quot;.shortcode-rand-1 .title-separator.separator-border { background-color: ; }.shortcode-rand-1 .section-title { text-transform: none; }&quot;\"><div class=\"title-wrap\"><h2 class=\"section-title\">Passivated Copper<\/h2><\/div><!-- .title-wrap --><span class=\"title-separator separator-border\"><\/span><div class=\"section-description\"><\/div><!-- .section-description --><\/div><!-- .section-title-wrapper -->[vc_column_text]This process consists in protecting copper with a layer formed by particular organic substances, with indicative thickness of 0,3 \u00b5m. The result is a surface absolutely uniform and planar.<\/p>\n<p>Today&#8217;s copper passivation processes are designed to withstand <strong>multiple soldering<\/strong> cycles, also lead-free type; the solder joint is formed directly between tin and copper.<\/p>\n<p>The passivated copper finishing, compliant to RoHS Directive, is the <strong>least aggressive<\/strong> towards the printed circuit board in terms of chemical and thermal and, if necessary, it can be <strong>reworkable<\/strong>.[\/vc_column_text][\/vc_tta_section][vc_tta_section title=&#8221;Immersion Silver&#8221; tab_id=&#8221;immersion-silver&#8221;]<div class=\"section-title-wrapper text-left shortcode-rand-2 factrie-inline-css\" data-css=\"&quot;.shortcode-rand-2 .title-separator.separator-border { background-color: ; }.shortcode-rand-2 .section-title { text-transform: none; }&quot;\"><div class=\"title-wrap\"><h2 class=\"section-title\">Immersion Silver<\/h2><\/div><!-- .title-wrap --><span class=\"title-separator separator-border\"><\/span><div class=\"section-description\"><\/div><!-- .section-description --><\/div><!-- .section-title-wrapper -->[vc_column_text]The <strong>Immersion Silver<\/strong> process consists in the deposition of an extremely even and planar silver layer.<\/p>\n<p>The thickness ranges from 0.15 to 0.5 \u00b5m and provides excellent solderability with both traditional and <strong>lead-free<\/strong> alloys; the solder joint is formed directly between tin and copper.<br \/>\nThe chemistry of the process works at low temperature and is designed to give to the silver layer a <strong>high resistance to oxidation<\/strong>.<\/p>\n<p>This Immersion Silver finishing is in compliance with the RoHS Directive[\/vc_column_text][\/vc_tta_section][vc_tta_section title=&#8221;Mixed finishing&#8221; tab_id=&#8221;mixed-finishing&#8221;]<div class=\"section-title-wrapper text-left shortcode-rand-3 factrie-inline-css\" data-css=\"&quot;.shortcode-rand-3 .title-separator.separator-border { background-color: ; }.shortcode-rand-3 .section-title { text-transform: none; }&quot;\"><div class=\"title-wrap\"><h2 class=\"section-title\">Mixed finishing<\/h2><\/div><!-- .title-wrap --><span class=\"title-separator separator-border\"><\/span><div class=\"section-description\"><\/div><!-- .section-description --><\/div><!-- .section-title-wrapper -->[vc_column_text]If necessary, it is possible to apply <strong>different surface<\/strong> finishings on the <strong>same PCB<\/strong>. This occurs in the case when, for example, on a printed circuit there are simultaneously required contacting areas to be realized in Electrolytic Gold-Nickel and other areas, dedicated to SMT assembly, where passivated copper or ENIG finishing are needed.[\/vc_column_text][\/vc_tta_section][vc_tta_section title=&#8221;Hot Air Solder Levelling&#8221; tab_id=&#8221;hot-air-solder-levelling&#8221;]<div class=\"section-title-wrapper text-left shortcode-rand-4 factrie-inline-css\" data-css=\"&quot;.shortcode-rand-4 .title-separator.separator-border { background-color: ; }.shortcode-rand-4 .section-title { text-transform: none; }&quot;\"><div class=\"title-wrap\"><h2 class=\"section-title\">Hot Air Solder Levelling<\/h2><\/div><!-- .title-wrap --><span class=\"title-separator separator-border\"><\/span><div class=\"section-description\"><\/div><!-- .section-description --><\/div><!-- .section-title-wrapper -->[vc_column_text]During this process, which today still represents the most common method of solderable surface finishing, the printed circuit board, after the soldermask step, is immersed in a molten <strong>Tin-Lead alloy<\/strong> and, during the subsequent extraction step it is hit by jets of hot air at high pressure which have the task of \u201cleveling\u201d the deposit, removing the excess of alloy from the holes and the pads.<\/p>\n<p>Despite the considerable experience aquired, given that it is a historical finish, the flatness of the HASL finishing is strictly dependent on the circuit lay-out, with thicknesses that can be very variable.<\/p>\n<p>On the other hand it is an easily inspectable finishing and maintains good characteristics of solderability over time, even with multiple soldering cycles; the solder joint is formed between tin and copper.[\/vc_column_text][\/vc_tta_section][vc_tta_section title=&#8221;Hot Air Solder Levelling (Lead free)&#8221; tab_id=&#8221;hot-air-solder-levelling-lead-free&#8221;]<div class=\"section-title-wrapper text-left shortcode-rand-5 factrie-inline-css\" data-css=\"&quot;.shortcode-rand-5 .title-separator.separator-border { background-color: ; }.shortcode-rand-5 .section-title { text-transform: none; }&quot;\"><div class=\"title-wrap\"><h2 class=\"section-title\">Hot Air Solder Levelling (lead free)<\/h2><\/div><!-- .title-wrap --><span class=\"title-separator separator-border\"><\/span><div class=\"section-description\"><\/div><!-- .section-description --><\/div><!-- .section-title-wrapper -->[vc_column_text]The operating mechanism of this process is the same of the traditional <strong>Hot Air Solder Levelling<\/strong>, with the difference that the alloy used is <strong>free from lead<\/strong>, in such a way as to make the surface finish compliant with the RoHS Directive.<\/p>\n<p>The alloys used are usually tin based, with small amounts of silver and copper, but alloys containing nickel also exist.<\/p>\n<p>In consideration that the eutectic point of these alloys is higher than those based on Sn\/Pb, the working temperature of HASL Lead-Free is higher and therefore the greater thermal stress to the printed circuit board should be taken into consideration.[\/vc_column_text][\/vc_tta_section][vc_tta_section title=&#8221;Electroless Gold Nickel&#8221; tab_id=&#8221;electroless-gold-nickel&#8221;]<div class=\"section-title-wrapper text-left shortcode-rand-6 factrie-inline-css\" data-css=\"&quot;.shortcode-rand-6 .title-separator.separator-border { background-color: ; }.shortcode-rand-6 .section-title { text-transform: none; }&quot;\"><div class=\"title-wrap\"><h2 class=\"section-title\">Electroless Gold Nickel<\/h2><\/div><!-- .title-wrap --><span class=\"title-separator separator-border\"><\/span><div class=\"section-description\"><\/div><!-- .section-description --><\/div><!-- .section-title-wrapper -->[vc_column_text]This surface finish is composed of two layers deposited by chemical processes: a layer of nickel, with a thickness of 3-8 \u00b5m, and a subsequent layer of pure gold with a thickness whose value can fluctuate between 0.04 and 0.12 \u00b5m. The Gold is the real protective finishing while the nickel is used to prevent the migration of copper into Gold.<\/p>\n<p>It is a planar finish, able to withstand multiple soldering cycles. It is easy to solder, even after long periods of storage; the solder joint is formed between tin and nickel.<\/p>\n<p>The ENIG finishing, which is compliant with the RoHS Directive, is particularly suitable for \u201cfine pitch\u201d printed circuit boards and can be also used for contacting areas.[\/vc_column_text][\/vc_tta_section][vc_tta_section title=&#8221;Electrolytic Gold Nickel&#8221; tab_id=&#8221;electrolytic-gold-nickel&#8221;]<div class=\"section-title-wrapper text-left shortcode-rand-7 factrie-inline-css\" data-css=\"&quot;.shortcode-rand-7 .title-separator.separator-border { background-color: ; }.shortcode-rand-7 .section-title { text-transform: none; }&quot;\"><div class=\"title-wrap\"><h2 class=\"section-title\">Electrolytic Gold Nickel<\/h2><\/div><!-- .title-wrap --><span class=\"title-separator separator-border\"><\/span><div class=\"section-description\"><\/div><!-- .section-description --><\/div><!-- .section-title-wrapper -->[vc_column_text]Even if it cannot be considered a solderable surface finishing, this process is applied, generally after the solder mask, to protect the contacting elements, especially when a high number of operations is required during the service life (sliding contacts are an example).<\/p>\n<p>In this case, the deposits are obtained through an electrolytic process: at first, a layer of nickel with a thickness of at least 5 \u00b5m is deposited, followed by a layer of gold with variable thickness, depending on customer&#8217;s specification, even up to 3 \u00b5m.<\/p>\n<p>The deposit of gold contains a small percentage of a metal binder (generally Cobalt) that gives the necessary characteristics of hardness (&#8220;<strong>Hard Gold<\/strong>&#8220;).[\/vc_column_text][\/vc_tta_section][vc_tta_section title=&#8221;Immersion Tin&#8221; tab_id=&#8221;immersion-tin&#8221;]<div class=\"section-title-wrapper text-left shortcode-rand-8 factrie-inline-css\" data-css=\"&quot;.shortcode-rand-8 .title-separator.separator-border { background-color: ; }.shortcode-rand-8 .section-title { text-transform: none; }&quot;\"><div class=\"title-wrap\"><h2 class=\"section-title\">Immersion Tin<\/h2><\/div><!-- .title-wrap --><span class=\"title-separator separator-border\"><\/span><div class=\"section-description\"><\/div><!-- .section-description --><\/div><!-- .section-title-wrapper -->[vc_column_text]The <strong>immersion tin<\/strong> process consists in the chemical deposition a layer of tin with a thickness variable between 0.8 and 1.2 \u00b5m. It is a finishing in accordance with the RoHS Directive which offers excellent characteristics of flatness and which is able to withstand <strong>multiple soldering cycles<\/strong>, also<strong> lead-free<\/strong>.<\/p>\n<p>The solder joint is formed directly between tin and copper. The printed circuit boards with chemical tin finishing are suitable for<strong> press-fit<\/strong> mounting technology also.[\/vc_column_text][\/vc_tta_section][vc_tta_section title=&#8221;Electrolytic Tin&#8221; tab_id=&#8221;electrolytic-tin&#8221;]<div class=\"section-title-wrapper text-left shortcode-rand-9 factrie-inline-css\" data-css=\"&quot;.shortcode-rand-9 .title-separator.separator-border { background-color: ; }.shortcode-rand-9 .section-title { text-transform: none; }&quot;\"><div class=\"title-wrap\"><h2 class=\"section-title\">Electrolytic Tin<\/h2><\/div><!-- .title-wrap --><span class=\"title-separator separator-border\"><\/span><div class=\"section-description\"><\/div><!-- .section-description --><\/div><!-- .section-title-wrapper -->[vc_column_text]The <strong>Electrolytic Tin<\/strong> process is one of the possibilities that Silga, given the considerable experience in the galvanic field, is able to offer to fulfill <strong>particular requests or special products<\/strong>. In this case, a layer of tin is deposited by an electrolytic process with a thickness from 3 to 10 \u00b5m.<\/p>\n<p>This finishing, compliant with the RoHS Directive, can be applied both on rigid and flexible printed circuit boards and ensures in the short term a<strong> good solderability<\/strong>.[\/vc_column_text][\/vc_tta_section][\/vc_tta_tour][\/vc_column][\/vc_row]<\/p>\n","protected":false},"excerpt":{"rendered":"<p>[vc_row][vc_column][vc_single_image image=&#8221;2251&#8243; img_size=&#8221;full&#8221;][vc_column_text]Silga is a leader company in galvanic treatments, and surface finishings. Its PCBs division can get all the know-how from that, never reached from anyone else in the same sector. Thank&#8217;s to the big variety of surface finishings, Silga become a primacy for: Range of products Innovation Realiability [\/vc_column_text][\/vc_column][\/vc_row][vc_row css=&#8221;.vc_custom_1605291204225{margin-top: 50px !important;}&#8221;][vc_column][vc_tta_tour style=&#8221;flat&#8221;<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":2262,"menu_order":12,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-2068","page","type-page","status-publish","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Surface finishings - Silga<\/title>\n<meta name=\"description\" content=\"Silga offers a wide range of surface finishings, available internally thanks to its galvanic treatments division. 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